Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers,申请号IL20130225744-传众专利搜索

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发明名称	Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers
摘要
申请公布号	IL225744(D0)	申请公布日期	2013.06.27
申请号	IL20130225744	申请日期	2013.04.14
申请人	BASF SE	发明人
分类号	C09G	主分类号	C09G
代理机构		代理人
主权项
地址

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