发明名称 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a reliable electronic component and a manufacturing method thereof. <P>SOLUTION: An electronic component comprises: a ceramic element body having a plurality of internal electrodes formed therein; and external electrodes formed outside the ceramic element body. Each of the external electrodes includes a copper (Cu) electrode layer electrically connected to the internal electrodes, a copper (Cu)-tin (Sn) alloy layer formed outside the electrode layer, and a tin (Sn) plating layer formed outside the alloy layer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013128090(A) 申请公布日期 2013.06.27
申请号 JP20120098882 申请日期 2012.04.24
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM HYUN TAE;JUNG HEE JUNG;ONO MASAAKI;KWON SANG HOON;KIM SEOUNG HO;CHOI JONG WOO
分类号 H01G4/252;H01G4/12;H01G4/228;H01G4/232;H01G4/30;H01G13/00 主分类号 H01G4/252
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