发明名称 |
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reliable electronic component and a manufacturing method thereof. <P>SOLUTION: An electronic component comprises: a ceramic element body having a plurality of internal electrodes formed therein; and external electrodes formed outside the ceramic element body. Each of the external electrodes includes a copper (Cu) electrode layer electrically connected to the internal electrodes, a copper (Cu)-tin (Sn) alloy layer formed outside the electrode layer, and a tin (Sn) plating layer formed outside the alloy layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013128090(A) |
申请公布日期 |
2013.06.27 |
申请号 |
JP20120098882 |
申请日期 |
2012.04.24 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KIM HYUN TAE;JUNG HEE JUNG;ONO MASAAKI;KWON SANG HOON;KIM SEOUNG HO;CHOI JONG WOO |
分类号 |
H01G4/252;H01G4/12;H01G4/228;H01G4/232;H01G4/30;H01G13/00 |
主分类号 |
H01G4/252 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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