发明名称 BENDING MODULE PROVIDED TO ENDOSCOPE EQUIPMENT AND MANUFACTURING METHOD THEREOF
摘要 A manufacturing method of a bending module according to one embodiment of the present invention comprises the steps of: forming a plurality of joint members by press-processing a sheet material, wherein each joint member has a joint member body, at least one connection protrusion and at least one wire guide protrusion having a wire guide hole are formed at one side corner of the joint member body, and at least one connection protrusion is formed at the other side corner of the joint member body; folding the wire guide protrusions with respect to the joint member bodies; forming a joint member assembly by arranging the plurality of joint members in parallel and connecting the neighboring two connection members such that plurality of joint members is connected to each other; bending the joint member assembly such that each of the joint members has a ring shape; and connecting each joint member to each other by welding the corners at both ends thereof.
申请公布号 WO2013094965(A1) 申请公布日期 2013.06.27
申请号 WO2012KR11073 申请日期 2012.12.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, JIN-WON;PARK, MUN-KUE;LIM, SU-KWANG
分类号 A61B1/005;A61B1/012 主分类号 A61B1/005
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