PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
摘要
<p>Disclosed is a printed circuit board. The printed circuit board includes an insulating layer, a copper foil formed on the insulating layer and formed therein with a groove to expose a portion of a top surface of the insulating layer, and a thermal conductive layer filled in the groove.</p>
申请公布号
WO2013094842(A1)
申请公布日期
2013.06.27
申请号
WO2012KR06671
申请日期
2012.08.22
申请人
LG INNOTEK CO., LTD.;CHO, YONG SEOK;KIM, CHANG SUNG
