| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated device and a semiconductor integrated device mounting method, which can reduce impedance of a power supply path. <P>SOLUTION: A semiconductor integrated device 10 comprise: a semiconductor integrated circuit 13 including a plurality of pads 17, 18, 19 in which the pad 19 is dedicated to a capacitor; and a capacitor element 14 directly mounted to the pad 19 which is dedicated to the capacitor. <P>COPYRIGHT: (C)2013,JPO&INPIT |
