| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such problems in conventional techniques that: in a rear-face non-contact type wafer inspection apparatus, a wafer bends due to deadweight to cause decrease in inspection accuracy; and when suppressing the bending of the wafer, it is desired to minimize the possibility for foreign matter to adhere to the wafer. <P>SOLUTION: In this invention, a temperature difference is provided between a front face and a rear face of a wafer. More specifically, the temperature of the front face of the wafer is set to be larger than the temperature of the rear face. More specifically, in a chuck part of a wafer inspection apparatus, a heater is provided on the wafer front face side where inspection is performed, while a cooler is provided on the rear face side, so that the temperature difference is provided in the wafer and the bending of the wafer is controlled, so as to suppress the bending of the wafer due to deadweight. <P>COPYRIGHT: (C)2013,JPO&INPIT |
