SEMICONDUCTOR PACKAGE, METHOD AND MOLD FOR PRODUCING SAME, INPUT AND OUTPUT TERMINALS OF SEMICONDUCTOR PACKAGE

摘要

Provided is an inexpensive semiconductor package having excellent high frequency characteristics, said semiconductor package having a high-output semiconductor element for high frequencies mounted thereupon. This semiconductor package (1) is provided with: a semiconductor element (12) to or from which a high-frequency signal is inputted or outputted; plate-like lead terminals (13), one end of each being electrically connected to an input terminal or an output terminal of the semiconductor element (12); a sealing resin (16) that seals the lead terminals (13) and the semiconductor element (12) in such a manner that the other ends of the lead terminals (13) are exposed; and ground reinforcement metal bodies (15) that are sealed by the sealing resin (16) in such a manner that first main surfaces face the lead terminals (13), and second main surfaces protrude from the sealing resin (16).