发明名称 |
ENABLING PACKAGE-ON-PACKAGE (POP) PAD SURFACE FINISHES ON BUMPLESS BUILD-UP LAYER (BBUL) PACKAGE |
摘要 |
<p>A bumpless build-up layer (BBUL) integrated circuit package and method of manufacturing are presented. In some embodiments, the package-on-package (PoP) pads of the BBUL integrated circuit package has a surface finish that can be palladium, nickel-palladium, nickel-gold, nickel-palladium-gold, or palladium-nickel-palladium-gold. In some embodiments, the PoP pad surface finish can be formed using either an electroless or electrolytic process.</p> |
申请公布号 |
WO2013095405(A1) |
申请公布日期 |
2013.06.27 |
申请号 |
WO2011US66320 |
申请日期 |
2011.12.20 |
申请人 |
INTEL CORPORATION;ZHANG, QINGLEI;WU, TAO;HLAD, MARK S.;GURUMURTHY, CHARAVANA K. |
发明人 |
ZHANG, QINGLEI;WU, TAO;HLAD, MARK S.;GURUMURTHY, CHARAVANA K. |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|