| 摘要 |
<p>A method and device for detecting defects in substrate. The method comprises: providing a detection beam and a reference beam; projecting the detection beam into incident points (117a) on a first surface (116a) of a substrate (116) along optical detection paths to reflection points (117b) on a second surface (116b), each reflection point corresponding to an incident point; the set of backscattered light generated at different points along the optical detection paths that the detection beam passes is treated as the sample beam corresponding to each point; collecting the interference signals formed by the interference between the sample beams and the reference beam to obtain the light intensity information of the backscattered light at different points along the optical detection paths and the information of optical lengths between different points along the optical detection paths; determining whether defects exist along the optical detection paths according to the light intensity information of the backscattered light at different points along the optical detection paths. The method accurately distinguishes the type of defects in a substrate, thereby enhancing defect detection accuracy.</p> |
