| 摘要 |
PURPOSE: A method for manufacturing a semiconductor chip is provided to prevent the chipping and the crack of the semiconductor chip in the back grinding of a wafer by using the filler for a filling groove. CONSTITUTION: A filling groove(101) is formed by half-cutting unit semiconductor chips(140) on a wafer(100). A filler(110) is filled in the filling groove. The backside of the wafer is ground until the filler is exposed. A mount tape(130) is adhered to the backside of the wafer in order to fix the wafer. The filler and the semiconductor chip are washed. |
