发明名称 INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN
摘要 Provided, in one embodiment, is an integrated circuit (IC) leadframe. In one example, the leadframe includes a paddle, wherein the paddle has a surface configured to accept an IC chip and has at least one edge, the at least one edge having one or more slots located therein. In this example, the leadframe may further include a plurality of lead fingers having ends extending toward the at least one edge, wherein the ends of ones of pairs of adjacent lead fingers extend into corresponding slots in the paddle.
申请公布号 US2013161805(A1) 申请公布日期 2013.06.27
申请号 US201113333604 申请日期 2011.12.21
申请人 FISHLEY CLIFFORD R.;KRANTZ JOHN J.;AWUJOOLA ABIOLA;LIM ALLEN S.;KING STEPHEN M.;GOLICK LAWRENCE W.;REBELO ASHLEY;LSI CORPORATION 发明人 FISHLEY CLIFFORD R.;KRANTZ JOHN J.;AWUJOOLA ABIOLA;LIM ALLEN S.;KING STEPHEN M.;GOLICK LAWRENCE W.;REBELO ASHLEY
分类号 H01L23/495;H05K3/30 主分类号 H01L23/495
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