SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provided a semiconductor device manufacturing method which causes less contamination of a semiconductor chip and which has good manufacturing efficiency.

SOLUTION: A manufacturing method of a semiconductor chip having a semiconductor chip, comprises: step A of preparing semiconductor chips; step B of preparing a resin sheet having a thermoset resin layer; step C of arranging a plurality of semiconductor chips on the thermoset resin layer; and step D of arranging cover films on the plurality of semiconductor chips and burying the plurality of semiconductor chips in the thermoset resin layer by pressure applied via the arranged cover films. A contact angle of the cover film to water is lower than or equal to 90°.

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