| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sensor package having a simple wiring structure to prevent an increase in chip size and a method for manufacturing the sensor package. <P>SOLUTION: The method for manufacturing the sensor package includes the processes of: forming a sensor including a fixed portion, a movable electrode having one end portion fixed to the fixed portion and a fixed electrode arranged around the surrounding of the movable electrode and a frame portion for surrounding the sensor on a first substrate; forming a first terminal electrically connected to the movable electrode via the fixed portion, a second terminal which is arranged on the fixed electrode and is electrically connected to the fixed electrode, and third terminal and forth terminals arranged on the frame portion; preparing a second substrate formed with first wiring for connecting the second terminal and the third terminal and second wiring for connecting the first terminal and the fourth terminal on one surface; making the one surface of the second substrate face the sensor and the frame portion; sealing the sensor by joining the second substrate and the frame portion with an adhesive; connecting the second terminal and the third terminal via the first wiring; and connecting the first terminal and the fourth terminal via the second wiring. <P>COPYRIGHT: (C)2013,JPO&INPIT |
