发明名称 |
HEAT RADIATION PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, BACKLIGHT UNIT INCLUDING THE SAME, AND LIQUID CRYSTAL DISPLAY DEVICE |
摘要 |
Provided are a heat radiation printed circuit board and a method of manufacturing the same, the heat radiation printed circuit board being produced by the method including: forming a circuit layer having an insulating layer, a circuit pattern and a solder resist on a first area of one surface of a metal substrate; and forming a bending part in a second area, in which the insulating layer is not formed, by bending the metal substrate, whereby a crack can be prevented in advance from being generated in the insulating layer, and durability and reliability of the heat radiation printed circuit board and a backlight unit applying the same can be improved. |
申请公布号 |
WO2013094950(A1) |
申请公布日期 |
2013.06.27 |
申请号 |
WO2012KR11019 |
申请日期 |
2012.12.17 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
PARK, HYUN GYU;CHO, IN HEE;HONG, SEUNG KWON;KIM, MIN JAE;LEE, HYUK SOO |
分类号 |
H05K7/20;G02F1/13357;H05K1/02 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|