| 摘要 |
<p>As regards the defect in the prior art that a probe cannot be in good contact with a solder ball since the upper surface of the solder ball is a sphere, provided is method for preparing a solder lug which can overcome the abovementioned defect. Provided is a method for preparing a solder lug. The method includes: providing a silicon wafer on which a solder lug is to be prepared; forming an under bump metal layer on one side of the silicon wafer where a solder disc is formed; preparing a solder on the under bump metal layer at a position where there is a solder disc; refluxing the solder, and during refluxing, utilizing a height limiter parallel to the silicon wafer to restrain the height of the formed solder lug so as to be lower than that of the formed solder when the height limiter is not used, so that the upper surface of formed solder lug after refluxing is a plane.</p> |
