| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a card that can be manufactured through simple manufacturing processes and in which an electronic module can be maintained at a proper position, and a manufacturing method of the card. <P>SOLUTION: A card 20 includes an electronic module 10, an intermediate base material 23, an upper layer 21, and a lower layer 22. The electronic module 10 includes a module substrate 11 having through-holes 11a penetrating through the module substrate in a vertical direction Z. The intermediate base material 23 includes a module substrate placement hole 23a that has the module substrate 10 disposed therein and penetrates through the intermediate base material in the vertical direction Z. The card 20 further includes holding parts 30 that are connected to the intermediate base material 23 by welding through the through-holes 11a in such a manner as to interpose the through-hole portions of the module substrate 11 between the holding parts in the vertical direction Z, in order to hold the module substrate 11 with respect to the intermediate base material 23. <P>COPYRIGHT: (C)2013,JPO&INPIT |
