发明名称 |
COPPER POWDER, COPPER PASTE AND METHOD FOR PREPARING COPPER POWDER |
摘要 |
Disclosed herein are copper powder, a copper paste and a method for preparing a copper powder. The copper powder is provided with a cuprous oxide film having a loose structure on a surface of the copper powder, thereby preventing the copper particles from being naturally oxidized, making it possible to being subjected to a low temperature firing process and having improved conductivity.
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申请公布号 |
US2013164553(A1) |
申请公布日期 |
2013.06.27 |
申请号 |
US201213721343 |
申请日期 |
2012.12.20 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD.;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE KWI JONG;LEE YOUNG IL;KWON JI HAN;KIM DONG HOON |
分类号 |
H01B1/02;H01B13/00 |
主分类号 |
H01B1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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