发明名称 COPPER POWDER, COPPER PASTE AND METHOD FOR PREPARING COPPER POWDER
摘要 Disclosed herein are copper powder, a copper paste and a method for preparing a copper powder. The copper powder is provided with a cuprous oxide film having a loose structure on a surface of the copper powder, thereby preventing the copper particles from being naturally oxidized, making it possible to being subjected to a low temperature firing process and having improved conductivity.
申请公布号 US2013164553(A1) 申请公布日期 2013.06.27
申请号 US201213721343 申请日期 2012.12.20
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD.;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE KWI JONG;LEE YOUNG IL;KWON JI HAN;KIM DONG HOON
分类号 H01B1/02;H01B13/00 主分类号 H01B1/02
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