| 摘要 |
<P>PROBLEM TO BE SOLVED: To remove a chamfer part of a wafer and grind a flat part without using a rotation blade. <P>SOLUTION: A wafer grinding apparatus (10) grinds a wafer (60) including a chamfer part (68) positioned at an outer periphery and a flat part (67) positioned at the inner side of the chamfer part. The wafer grinding apparatus comprises: a cup type grindstone (36) grinding the wafer; and moving mechanism parts (23, 25) moving the wafer relative to the cup type grindstone so that the chamber part or the flat part of the wafer is positioned at a position corresponding to the cup type grindstone. After the chamfer part of the wafer is positioned at the position corresponding to the cut type grindstone by the moving mechanism parts and the chamber part of the wafer is removed by the cup type grindstone, the flat part of the wafer is positioned at the position corresponding to the cut type grindstone by the moving mechanism parts, and the flat part of the wafer is ground by the cup type grindstone. <P>COPYRIGHT: (C)2013,JPO&INPIT |
