PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to exclude a grinding process for reducing a step height, thereby uniformly forming the thickness of a pattern. CONSTITUTION: A printed circuit board includes a first upper and a first lower insulating layer (121,122), a through-via (132), and a second upper and a second lower insulating layer (161,162). The first upper and the first lower insulating layer respectively cover the upper and the lower surface of a substrate. A through-via penetrates the substrate and the first upper and the first lower insulating layer. The second upper and the second lower insulating layer cover the through-via. A general circuit region includes a circuit pattern. A minute circuit region includes a minute circuit pattern.