发明名称 LIGHT-EMITTING DEVICE MOUNTING PACKAGE, LIGHT-EMITTING DEVICE PACKAGE, AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting component mounting package that is capable of suppressing characteristic deterioration of a reflection film, a light-emitting component package obtained by mounting a plurality of light-emitting components on the light-emitting component mounting package, and a manufacturing method of the packages. <P>SOLUTION: A manufacturing method of a light-emitting device mounting package includes the steps of: performing electrolytic plating on a predetermined region on a metal layer laminated on a surface of an insulation layer using the metal layer as a power supply layer to thereby form a light-emitting device mounting region composed of a pair of electrolytic plating films formed to be spaced apart from each other by a predetermined distance; and removing a predetermined part of the metal layer to thereby form a light-emitting device mounting part in which a plurality of wirings are arranged to be spaced apart from each other by a predetermined distance, wherein when forming the light-emitting device mounting part, the metal layer is removed so that one of the pair of electrolytic plating films belongs to one of the adjacent wirings and the other of the pair of electrolytic plating films belongs to the other of the adjacent wirings. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013128081(A) 申请公布日期 2013.06.27
申请号 JP20110277736 申请日期 2011.12.19
申请人 SHINKO ELECTRIC IND CO LTD 发明人 KOBAYASHI KAZUKI;ARAI SUNAO;KIMURA YASUYUKI
分类号 H01L33/62 主分类号 H01L33/62
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