METHOD FOR INSPECTING HOLE FORMED BY LASER DRILLING

摘要

PURPOSE: A laser drilling hole inspecting method is provided to prevent the contact failure of a flexible PCB(Printed Circuit Board) and to improve reliability with respect to a quality of the PCB. CONSTITUTION: A laser drilling hole inspecting method comprises: a step(110) of acquiring images of a first hole formed on the top surface of a second copper foil layer; a step(120) of acquiring images of a second hole formed on the underside of an insulating layer; a step(151) of calculating the diameter of the first hole based on the images thereof, the diameter of the second hole based on the images thereof, and an inclined angle of a drilling hole by using the diameter of the first hole, the diameter of the second hole, the thickness of the second copper foil layer and the insulating layer; and a step(152) of determining whether the treatment of the drilling hole is good or not by comparing the calculated inclined angle and a reference inclined angle set in advance for a criteria of a quality. [Reference numerals] (110) First acquisition step; (120) Second acquisition step; (130) Focusing adjustment step; (140) Conversion step; (151) Angle calculation step; (152) First discrimination step; (161) Circularity calculation step; (162) Second discrimination step; (171) Area ratio calculation step; (172) Third discrimination step