DRY FILM, PRINTED WIRING BOARD USING SAME, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND FLIP CHIP MOUNTING SUBSTRATE

摘要

Provided are: a dry film capable of forming a curable coating exhibiting excellent laser processability and desmear resistance; and a printed wiring board using said dry film. Also provided are: a method for producing a printed wiring board for a flip chip mounting substrate whereby it is possible to easily form a dam for preventing the spreading of underfill; a printed wiring board produced by means of said method; and a flip chip mounting substrate in which a chip is flip-chip mounted on said printed wring board. A dry film characterized by being provided with a carrier film and a photocurable resin composition layer (L1) formed by coating and drying a photocurable resin composition, wherein at least a thermosetting resin composition layer (L2) formed by coating and drying a thermosetting resin composition is disposed between the carrier film and the photocurable resin composition layer (L1). A method for producing a printed wiring board, the method being characterized by involving: a step for forming a resin insulating layer on a substrate surface, said resin insulating layer having the thermosetting resin composition layer (L2) and the photocurable resin composition layer (L1) in said order from the side of the substrate surface; a step for forming a pattern by means of a photolithography method; and a step for forming a pattern by means of laser processing.