A system and method for selectively removing tire material from the bead portions of a cured tire to reduce one or more harmonics of at least one uniformity parameter are disclosed. According to aspects of the present disclosure, tire material is selectively removed using a plurality of direct address commands. The direct address commands specify ablation parameters for discrete ablation segments at specific angular locations around the bead of the tire. The direct address commands are generated by analyzing the desired ablation pattern for the bead of the tire. The ablation device can then be controlled to selectively remove tire material in discrete ablation segments at identified addresses pursuant to the direct address commands to achieve the desired ablation pattern on one or more tracks along the bead portion of the tire using a single pass of the ablation device.
申请公布号
WO2013095479(A1)
申请公布日期
2013.06.27
申请号
WO2011US66699
申请日期
2011.12.22
申请人
MICHELIN RECHERCHE ET TECHNIQUE, S.A.;SOCIETE DE TECHNOLOGIE MICHELIN;NICHOLSON, VERNER, STEVE;STONE, JAMES, EDWARD