发明名称 Substrate for Chip on Film
摘要 The present invention discloses a substrate including a flexible film, a plurality of sprocket holes disposed along a first direction on two sides of the flexible film, and a plurality of first chip zones disposed along the first direction on the flexible film, of which each first chip zone includes at least a testing module, an input module, a chip and an output module disposed along a second direction, where the first direction is orthogonal to the second direction.
申请公布号 US2013161616(A1) 申请公布日期 2013.06.27
申请号 US201213439840 申请日期 2012.04.04
申请人 HSU CHIR-HSIANG;HSU CHIN-HUNG;CHAN CHIH-CHIANG;CHEN HAI-LUN 发明人 HSU CHIR-HSIANG;HSU CHIN-HUNG;CHAN CHIH-CHIANG;CHEN HAI-LUN
分类号 H01L23/58 主分类号 H01L23/58
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