| 摘要 |
An apparatus and process for self-aligning components for forming an embedded die package is disclosed. The process includes providing a planar printed wire board (PWB) substrate having registration pads and a component having contact pads and spaced alignment pads, wherein the alignment pads each have a solder cap, placing the component on the substrate such that the alignment pads are in coarse alignment with the registration pads, applying heat to the alignment and registration pads to reflow the solder caps to precisely align the pads; and reducing the temperature below the reflow temperature. The process further includes applying a backside outer layer lamination, forming first vias, forming redistribution conductors on an opposite surface of the substrate connecting to the vias, and applying a front side outer layer lamination over the opposite surface of the substrate, all at temperatures below the reflow temperature. |
