发明名称 |
METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD AND MULTI-LAYER CIRCUIT BOARD MANUFACTURED BY USING THE METHOD |
摘要 |
A method of manufacturing a multi-layer circuit board includes: forming a first circuit layer on a first surface of a first prepreg; stacking a second prepreg on a first surface of the first circuit layer; and forming at least one of a second or a third circuit layer on at least one of a first surface of the second prepreg and a second surface opposite of the first surface of the first prepreg, wherein, in the stacking of the first prepreg, the first prepreg and the second prepreg are semi-cured. |
申请公布号 |
US2013161073(A1) |
申请公布日期 |
2013.06.27 |
申请号 |
US201213658870 |
申请日期 |
2012.10.24 |
申请人 |
SAMSUNG TECHWIN CO., LTD.;SAMSUNG TECHWIN CO., LTD. |
发明人 |
LEE SANG-MIN;KWON SOON-CHUL |
分类号 |
H05K1/02;H05K1/11;H05K3/36;H05K3/42;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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