<p>A land grid array socket assembly comprises a plurality of cells, with each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body.</p>
申请公布号
WO2012057767(A8)
申请公布日期
2013.06.27
申请号
WO2010US54503
申请日期
2010.10.28
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;RUBENSTEIN, BRANDON;NATTKEMPER, ROGER;DANIEL, ERIC R.
发明人
RUBENSTEIN, BRANDON;NATTKEMPER, ROGER;DANIEL, ERIC R.