发明名称 |
SEMICONDUCTOR CHIP ASSEMBLY AND METHOD OF PREPARING THE SAME |
摘要 |
A semiconductor chip assembly and a method for forming the same are provided. The semiconductor chip assembly comprises: a semiconductor chip (20), a substrate (10), a first layer (203) formed on a surface of the substrate (10), in which one of the first layer (203) and the second layer (204) has an opening (205) therein; and a second layer (204) formed on a surface of the semiconductor chip (20) and connected to the first layer (203) by eutectic bonding. |
申请公布号 |
EP2606509(A1) |
申请公布日期 |
2013.06.26 |
申请号 |
EP20110819399 |
申请日期 |
2011.08.16 |
申请人 |
BYD COMPANY LIMITED;SHENZHEN BYD AUTO R&D COMPANY LIMITED |
发明人 |
LIU, YINGCE;HUO, DONGMING;SUN, TIANBAO |
分类号 |
H01L21/58;H01L33/40 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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