发明名称 Interposer, circuit board module, and method for manufacturing interposer
摘要 <p>An interposer includes a substrate having first and second opposing surfaces, the substrate having a sheet shape; and a plurality of spring electrodes fixed to the substrate in a certain arrangement, each of the plurality of the spring electrodes including a first pad disposed opposite the first surface of the mesh and extending in a first direction, a second pad disposed opposite the second surface of the mesh and extending in the first direction, and a post extending through the substrate between the first and second surfaces and connecting an end of the first pad to an end of the second pad.</p>
申请公布号 EP2579697(A3) 申请公布日期 2013.06.26
申请号 EP20120186344 申请日期 2012.09.27
申请人 FUJITSU LIMITED 发明人 MORIYA, YASUO
分类号 H05K3/40;H05K1/03;H05K7/10 主分类号 H05K3/40
代理机构 代理人
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