发明名称 Dielectric thin film-forming composition, method of forming dielectric thin film and dielectric thin film formed by the method
摘要 <p>A liquid composition is provided for forming a thin film in the form of a mixed composite metal oxide in which a composite oxide B containing copper (Cu) and a composite oxide C containing manganese (Mn) are mixed into a composite metal oxide A represented with the general formula: Ba 1-x Sr x Ti y O 3 , wherein the molar ratio B/A of the composite oxide B to the composite metal oxide A is within the range of 0.002 < B/A< 0.05, and the molar ratio C/A of the composite oxide C to the composite metal oxide A is within the range of 0.002 < C/A < 0.03.</p>
申请公布号 EP2608219(A1) 申请公布日期 2013.06.26
申请号 EP20110306708 申请日期 2011.12.20
申请人 MITSUBISHI MATERIALS CORPORATION;STMICROELECTRONICS (TOURS) SAS 发明人 WATANABE, TOSHIAKI;SAKURAI, HIDEAKI;SOYAMA, NOBUYUKI;GUEGAN, GUILLAUME
分类号 H01B3/10 主分类号 H01B3/10
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