| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayered wiring board with excellent mountability for mounting a semiconductor element, capable of mounting without a shift between a bump position of a board and a bump position of the semiconductor element in mounting reflow of the semiconductor element, wherein the multilayered wiring board has a multilayered structure in which an insulating layer using an organic insulating material and a wiring layer using a conductive material are alternately laminated, and to provide a method for manufacturing the multilayered wiring board. <P>SOLUTION: A semiconductor element 201 is mounted by a flip-chip connection through solder bumps 203. The total pitch of pads for mounting the semiconductor element 201 disposed at the outermost layer of a multilayered wiring board 2000 is adjusted to be smaller than the total pitch of the bumps 203 of the semiconductor element 201 to be mounted, and to make both of the total pitches equal after the semiconductor element and the multilayered wiring board have been expanded with reflow heat in mounting. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
