发明名称 |
ELECTROCONDUCTIVE FINE PARTICLES, ANISOTROPIC ELECTROCONDUCTIVE MATERIAL, AND ELECTROCONDUCTIVE CONNECTION STRUCTURE |
摘要 |
<p>It is an object of the present invention to provide: a conductive fine particle, which is used for conductive connection between fine electrodes and tends not to give rise to a crack in the solder layer or disconnection caused by breakage in the connection interface between an electrode and the conductive fine particle even with a drop impact and the like, and tends not to have fatigue even after repetitive heating and cooling; an anisotropic conductive material obtained by using the conductive fine particle; and a conductive connection structure. The present invention relates to a conductive fine particle, which comprises a solder layer containing tin and being formed on a surface of a resin fine particle, with nickel adhered to a surface of the solder layer, and contains 0.0001 to 5.0% by weight of the nickel with respect to a total of a metal contained in the solder layer and the nickel adhered to the surface of the solder layer.</p> |
申请公布号 |
EP2139009(B1) |
申请公布日期 |
2013.06.26 |
申请号 |
EP20080739514 |
申请日期 |
2008.03.31 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
SUN, REN-DE;MATSUSHITA, KIYOTO;SASAKI, TAKU;UENOYAMA, SHINYA;OKUDA, MASAKI;OKINAGA, NOBUYUKI |
分类号 |
H01B5/00;B22F1/02;B23K35/26;C22C13/00;C23C18/16;C23C18/32;C23C18/34;C23C18/40;C23C18/48;C23C28/00;C23C28/02;C25D5/10;C25D5/12;C25D5/56;C25D7/00;H01L21/60;H05K3/34 |
主分类号 |
H01B5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|