BONDING WIRE IMPEDANCE MATCHING CIRCUIT

摘要

PURPOSE: A bonding wire impedance matching circuit is provided to send a signal in desired frequency with a minimum insertion loss without using a specially designed antenna for compensating a thin transmission line or an inductance, thereby being applied to diverse millimeter bands. CONSTITUTION: An impedance matching circuit(100) includes a first pad(110), a transmission line(120), a second pad(130), a dielectric substrate(140), and a ground(150). The ground is positioned on a lower surface of the dielectric substrate. The first pad is positioned on an upper surface of the dielectric substrate and is connected with a bonding wire. The transmission line is positioned on the upper surface of the dielectric substrate, and one end of the transmission line is separated from the first pad leaving a fixed gap. The second pad is positioned inside the dielectric substrate, and the first pad area and the area of the end of the transmission line are overlapped.