WAFER PROCESSING TAPE AND METHOD OF PRODUCING THE SAME

摘要

PURPOSE: A tape for processing a wafer and a manufacturing method thereof are provided to prevent an adhesive layer from being stripped from the adhesive layer of an adhesive tape. CONSTITUTION: An adhesive layer(3) is partly formed on a stripping film. The adhesive layer is divided into a junction reserved region(30) and a peripheral part(32) outside the junction reserved region. A pressure part(20) is formed on a starting point part(34) of the peripheral part and the other region(36). At least three pressure parts are formed from a lateral part to a central part of the adhesive layer. The pressure part is formed by pressing the peripheral part of the adhesive layer.