发明名称 |
EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME |
摘要 |
PURPOSE: An epoxy resin composition is provided to have excellent low absorption, low heat expansion, and high heat resistance. CONSTITUTION: An epoxy resin composition includes an epoxy resin, hardener, and inorganic filler as a main ingredient. The epoxy resin includes an epoxy resin represented by chemical formula 1. In chemical formula 1, R1 includes at least one benzene; and each of R2 and R3 is H or CH3. A heat radiating circuit board comprises a metal plate; an insulating layer formed on the metal plate; and a circuit pattern(300) formed on the insulating layer. The insulating layer is formed by curing the epoxy resin composition.
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申请公布号 |
KR20130069243(A) |
申请公布日期 |
2013.06.26 |
申请号 |
KR20110136871 |
申请日期 |
2011.12.16 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
PARK, JAE MAN;CHO, IN HEE;KIM, HAE YEON;YOON, JONG HEUM;MOON, SUNG BAE;PARK, JEUNG OOK;GIANG THANH KIEU;KIM, JIN HWAN |
分类号 |
C08G59/22;C08K3/00;C08L63/00;H05K7/20 |
主分类号 |
C08G59/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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