APPARATUS FOR POLISHING WAFER

摘要

PURPOSE: A device and a method of polishing a wafer are provided to effectively polish the wafer by simultaneously performing a polishing process and a dressing process. CONSTITUTION: A polishing pad(200) is arranged on a table(100). A head part is arranged on the polishing pad. A retainer is mounted on the head part and accommodates one or more wafers(W). The wafer is adhered to a ceramic plate(401). A part(201) of the wafer is placed in the outer side of the peripheral part of the polishing pad. A dressing part is extended along the wafer.