| 摘要 |
PURPOSE: A semiconductor device, a manufacturing method thereof, and an electronic device are provided to improve heat dissipation of a semiconductor device by installing a frame which has higher heat conductivity than an insulation layer around multiple semiconductor devices which are installed in the insulation layer. CONSTITUTION: A first semiconductor device(22) and a second semiconductor device(23) are installed in an insulation layer(21). A frame(24) is installed to surround the first semiconductor device and the second semiconductor device in the insulation layer. The frame is formed with a material which has higher heat conductivity than the insulation layer. A wiring layer(30) is formed in the upper side of the insulation layer. A heat dissipation layer(25) is installed by being connected to the frame. |
