| 摘要 |
<p>PURPOSE: A wiring board and a manufacturing method thereof are provided to connect optimally designed wiring blocks and to improve a connective reliability and heat radiating property with connecting substrates without using a component mounting technique such as a solder-solder connection. CONSTITUTION: A wiring board(1) includes a first multilayer wiring board(10), a second multilayer wiring board(20), and a bonding sheet. The first multilayer wiring board has multiple first conductive layers, and a first pad is formed on one side of the first multilayer wiring board. The second multilayer wiring board has multiple second conductive layers, and a second pad is formed on one side of the second multilayer wiring board. The first pad and the second pad mutually face, and then the first multilayer wiring board and the second multilayer wiring board are mutually bonded with the bonding sheet.</p> |
