LIGHT EMITTING DEVICE PACKAGE

摘要

PURPOSE: A light emitting device package is provided to improve durability by improving coupling properties between a substrate and a lead frame. CONSTITUTION: A first lead frame(11) has a chip support part(12) which supports a light emitting chip, and first and second external terminals(13,14) which are connected to external power source. A second lead frame(20) has a third external terminal(21) connected to the external power source. A third lead frame(30) is separated from the first and second lead frames. The third lead frame has a fourth external terminal(31) connected to the external power source. A substrate supports the first to third lead frames.