ADHESIVE FILM FOR SEMICONDUCTOR

摘要

PURPOSE: An adhesive film for semiconductors is provided to improve void properties and reliability properties by using an amine hardener and a phenol hardener together with an appropriate proportion. CONSTITUTION: An adhesive film for semiconductors is attached to a chip mounting surface of a wiring substrate. The adhesive film for semiconductors contains an amine hardener and a phenol hardener. A semiconductor chip is mounted on the adhesive film for semiconductors. The ratio(b/a) of a storage modulus(b) in 170°C after 80% hardening and a storage modulus(a) in 40°C before hardening the adhesive film for semiconductors is 1.5 to 3.0. The amine hardener is diamino diphenyl sulfone.