发明名称 EMI FILTER TERMINAL ASSEMBLY WITH WIRE BOND PADS FOR HUMAN IMPLANT APPLICATIONS
摘要 <p>A terminal assembly for active implantable medical devices includes a structural pad, in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device.</p>
申请公布号 EP1743347(B1) 申请公布日期 2013.06.26
申请号 EP20040794932 申请日期 2004.10.12
申请人 GREATBATCH LTD. 发明人 STEVENSON, ROBERT, A.;BRENDEL, RICHARD, L.;FRYSZ, CHRISTINE;HUSSEIN, HAYTHAM;KNAPPEN, SCOTT;STEVENSON, RYAN, A.
分类号 H01G4/35;A61N1/16;A61N1/36;A61N1/37;A61N1/375;H01G2/22;H01G4/228;H01J5/00;H02H9/06 主分类号 H01G4/35
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