| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce the number of processes and manufacturing costs by forming a circuit pattern with the same process as a via forming process, by forming the circuit pattern with plating without being bonded to a copper foil layer using a release film. CONSTITUTION: A printed circuit board(100) includes a base substrate(110), a base circuit pattern(120), an insulation layer(130), a first circuit pattern(140) and a via(145). The base circuit pattern is formed on the base substrate. The insulation layer covers the base circuit pattern. The first circuit pattern is formed on the insulation layer. The via connects the base circuit pattern and the first circuit pattern in the insulation layer. The first circuit pattern and the via are made of the same materials.
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