发明名称 |
RESISTIVE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
<p>PURPOSE: A resistive memory device and a method of manufacturing the same are provided to increase an integration density of the resistive memory devices by stacking a plurality of resistive memory cells, thereby increasing the memory capacity within a confined space. CONSTITUTION: A plurality of resistive memory cells is stacked on a semiconductor substrate. Each of the plurality of resistive memory cells includes a switching transistor and a resistive device layer(170) electrically connected to the switching transistor. A common source line(160) is electrically connected to the plurality of stacked resistive memory cells. A bit line(180) is electrically connected to the plurality of stacked resistive memory cells and insulated from the common source line.</p> |
申请公布号 |
KR20130068484(A) |
申请公布日期 |
2013.06.26 |
申请号 |
KR20110135699 |
申请日期 |
2011.12.15 |
申请人 |
SK HYNIX INC. |
发明人 |
PARK, NAM KYUN;CHOI, KANG SIK |
分类号 |
H01L27/115;H01L21/8247 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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