发明名称 RESISTIVE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <p>PURPOSE: A resistive memory device and a method of manufacturing the same are provided to increase an integration density of the resistive memory devices by stacking a plurality of resistive memory cells, thereby increasing the memory capacity within a confined space. CONSTITUTION: A plurality of resistive memory cells is stacked on a semiconductor substrate. Each of the plurality of resistive memory cells includes a switching transistor and a resistive device layer(170) electrically connected to the switching transistor. A common source line(160) is electrically connected to the plurality of stacked resistive memory cells. A bit line(180) is electrically connected to the plurality of stacked resistive memory cells and insulated from the common source line.</p>
申请公布号 KR20130068484(A) 申请公布日期 2013.06.26
申请号 KR20110135699 申请日期 2011.12.15
申请人 SK HYNIX INC. 发明人 PARK, NAM KYUN;CHOI, KANG SIK
分类号 H01L27/115;H01L21/8247 主分类号 H01L27/115
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