| 摘要 |
PURPOSE: A sputtering device is provided to improve usage efficiency of a sputtering target by forming even magnetic field in a front side of the sputtering target, and to minimize a damage of a processed article due to a high-energy particle. CONSTITUTION: A sputtering device(1) comprises a chamber(10), a sputtering target(30), a processed article supporting part(20), and a second magnet module(50). The sputtering target is arranged inside the chamber. The processed article supporting part is arranged in one side of the sputtering target to face the sputtering target, and a processed article is settled. A second magnet module comprises a first magnet module(40), and a second magnet module(50). The second magnet module is arranged in one side of the sputtering target in order to form a magnetic field by an interaction with the first magnet module. [Reference numerals] (AA) S pole; (BB) N pole
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