发明名称 |
HAPTICS SENSING DEVICE FOR MULTI-POINT AND SYSTEM INCLUDING THE SAME |
摘要 |
PURPOSE: A multi-point haptic sensing device and a system including the same are provided to stably perform by collecting precise sensor information through mounting on a robot used for a medical procedure or a medical appliance. CONSTITUTION: A multi-point haptic sensing device(100) comprises a substrate(112), a plurality of pressure structure(117) in a support shape, a semiconductor strain gauge, and a signal processing module(120). The substrate includes a circuit substrate(115) and a support plate unit(111). The circuit substrate is electrically connected to each strain gauge for collecting a sensing signal of the strain gauge(113). The circuit substrate, the pressure structure, and the semiconductor strain gauge are arranged in the support plate unit. [Reference numerals] (120) Signal processing module; (121) Amplifier; (123) Signal processing unit; (125) Offset adjusting unit |
申请公布号 |
KR101278679(B1) |
申请公布日期 |
2013.06.25 |
申请号 |
KR20110143362 |
申请日期 |
2011.12.27 |
申请人 |
KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
发明人 |
HWANG, JUNG HOON;KIM, SEUNG HUN;KWON, JOON HO |
分类号 |
B25J19/02;B25J15/08;G01L1/22 |
主分类号 |
B25J19/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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