发明名称 HAPTICS SENSING DEVICE FOR MULTI-POINT AND SYSTEM INCLUDING THE SAME
摘要 PURPOSE: A multi-point haptic sensing device and a system including the same are provided to stably perform by collecting precise sensor information through mounting on a robot used for a medical procedure or a medical appliance. CONSTITUTION: A multi-point haptic sensing device(100) comprises a substrate(112), a plurality of pressure structure(117) in a support shape, a semiconductor strain gauge, and a signal processing module(120). The substrate includes a circuit substrate(115) and a support plate unit(111). The circuit substrate is electrically connected to each strain gauge for collecting a sensing signal of the strain gauge(113). The circuit substrate, the pressure structure, and the semiconductor strain gauge are arranged in the support plate unit. [Reference numerals] (120) Signal processing module; (121) Amplifier; (123) Signal processing unit; (125) Offset adjusting unit
申请公布号 KR101278679(B1) 申请公布日期 2013.06.25
申请号 KR20110143362 申请日期 2011.12.27
申请人 KOREA ELECTRONICS TECHNOLOGY INSTITUTE 发明人 HWANG, JUNG HOON;KIM, SEUNG HUN;KWON, JOON HO
分类号 B25J19/02;B25J15/08;G01L1/22 主分类号 B25J19/02
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