发明名称 Solid-state imaging element, method of manufacturing the same, solid-state imaging apparatus, and imaging apparatus
摘要 A solid-state imaging element includes a semiconductor substrate that has a light reception portion performing a photoelectric conversion of an incident light; an oxide layer that is formed on a surface of the semiconductor substrate; a light shielding layer that is formed on an upper layer further than the oxide layer via an adhesion layer; and an oxygen supply layer that is disposed between the oxide layer and the adhesion layer and is formed of a material which shows an oxidation enthalpy smaller than that of a material forming the oxide layer.
申请公布号 US8471348(B2) 申请公布日期 2013.06.25
申请号 US201113216712 申请日期 2011.08.24
申请人 OHBA YOSHIYUKI;HIYAMA SUSUMU;OSHIYAMA ITARU;SONY CORPORATION 发明人 OHBA YOSHIYUKI;HIYAMA SUSUMU;OSHIYAMA ITARU
分类号 H01L31/0232;H01L21/00 主分类号 H01L31/0232
代理机构 代理人
主权项
地址