HEAT RADIATE MODULE FOR ELECTRONIC PARTS AND HEAT RADIATE LIQUID USED THE SAME

摘要

PURPOSE: An electronic component heat module and heat emitting fluid are provided to apply an efficient fluid cooling method, thereby increasing a lifetime of an electronic component. CONSTITUTION: A housing(10) comprises a fluid sealing structure. A substrate(20) is inserted into the housing and comprises a heat emitting electronic component(21). Heat emitting dispersion insulation fluid(30) is inserted into the housing. The heat emitting dispersion insulation fluid cools heat generated in the heat emitting electronic component by including insulation fluid and a heat conducting particle. A heat tank unit(50) is attached to one side of the housing and emits the heat of the heat emitting dispersion insulation fluid to the outside.