| 摘要 |
There is provided a probe card in contact with pads formed on a plurality of semiconductor dies on a wafer to test the semiconductor dies. The probe card includes a printed circuit board on which a plurality of pads are formed; a block plate having a plurality of grooves and attached to the printed circuit board; a plurality of sub-probe units equipped with a plurality of probe tips in contact with the pads of the semiconductor dies and detachably coupled to the plurality of grooves; and a plurality of interposer/space transformer units interposed between the sub-probe units and the printed circuit board and configured to electrically connect the probe tips to the pads of the printed circuit board and transform a pitch of the pads formed on the printed circuit to a pitch of the plurality of probe tips. |
