发明名称 |
Integrated inductor structure |
摘要 |
This invention provides an integrated inductor structure including a substrate, a metal coil layer on the substrate and a dielectric layer between the substrate and the metal coil layer. A well shielding structure for reducing eddy current is disposed in the substrate under the metal coil layer. The well shielding structure is chequered with a plurality of N wells and a plurality of P wells. The N wells and P wells are arranged in a chessboard-like manner. A P+ pickup ring is provided in the substrate to encompass the well shielding structure. A guard ring is formed directly on the P+ pickup ring.
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申请公布号 |
US8471357(B2) |
申请公布日期 |
2013.06.25 |
申请号 |
US20080277309 |
申请日期 |
2008.11.25 |
申请人 |
HUANG KAI-YI;YEH TA-HSUN;JEAN YUH-SHENG;REALTEK SEMICONDUCTOR CORP. |
发明人 |
HUANG KAI-YI;YEH TA-HSUN;JEAN YUH-SHENG |
分类号 |
H01L27/08 |
主分类号 |
H01L27/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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