发明名称 |
Semiconductor device and method for producing same |
摘要 |
A semiconductor device of the present invention has a semiconductor element region 17 that is provided in part of a silicon carbide layer 3 and a guard-ring region 18 that is provided in another part of the silicon carbide layer 3 surrounding the semiconductor element region 17 when seen in a direction perpendicular to a principal surface of the silicon carbide layer 3. The semiconductor device includes: an interlayer insulation film 10 which is provided on the principal surface of the silicon carbide layer 3 in the semiconductor element region 17 and the guard-ring region 18, the interlayer insulation film 10 having a relative dielectric constant of 20 or more; a first protective insulation film 14 provided on the interlayer insulation film in the guard-ring region 18; and a second protective insulation film 15 provided on the first protective insulation film 14, wherein the first protective insulation film 14 has a linear expansion coefficient which is between a linear expansion coefficient of a material of the second protective insulation film 15 and a linear expansion coefficient of a material of the interlayer insulation film 10.
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申请公布号 |
US8471267(B2) |
申请公布日期 |
2013.06.25 |
申请号 |
US201013129825 |
申请日期 |
2010.08.26 |
申请人 |
HAYASHI MASASHI;HASHIMOTO KOICHI;ADACHI KAZUHIRO;PANASONIC CORPORATION |
发明人 |
HAYASHI MASASHI;HASHIMOTO KOICHI;ADACHI KAZUHIRO |
分类号 |
H01L29/12;H01L21/31 |
主分类号 |
H01L29/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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